最新消息
SEMICON 2026 積水化學出展確定！
衷心感謝您平日對積水化學產品的鼎力支持與厚愛。
積水化學將參加於9月2日（三）至４日（五），一連三天在台北南港展覽館１、２館（TaiNEX 1&2）舉辦的「SEMICON TAIWAN 2026」國際半導體展。本次積水化學展位將展示半導體製造製程相關產品、替代PFAS的永續發展創新產品、高機能材料產品，以及積水化學集團的最新技術。
誠摯邀請您在百忙之中蒞臨積水化學展位指導。
１．展出時間
2026年 9月2日（三）10：00～17：00
2026年 9月3日（四）10：00～17：00
2026年 9月4日（五）10：00～16：00
２．展出地點
台北南港展覧館1、2館（TaiNEX 1＆2）
地址：台北市南港區経貿二路1號、2號
３．積水化學展位編號
・TaiNEX1 5F（南港展覽館１館）５樓展廳：展位編號H0031
・TaiNEX2 4F（南港展覽館２館）４樓展廳：展位編號S8343
４．主要展示產品
１）超純水用聚乙烯管材（CLPE）：替代PFAS的永續次世代管材
超純水用聚氯乙烯管材(CLVP)：替代PP的通用管材(Made in TAIWAN)
２）半導体製造製程使用之半導體材料
・SELFA：用於半導體製造晶圓與晶片製造的高黏著性、易解離的假貼固定膠帶
・Inkjet：光固化3D成形Inkjet用膠材・DAM材
・導熱片：具備優異熱傳導性與絕緣性的導熱材料
・潔淨容器Clean Bottle：符合聯合國UN規格,適用於高純度化學品與醫療用途的高潔淨容器
・CPO接著劑：用於CPO模組固定光纖的高黏著低收縮UV光學膠
・水冷封裝膠：用於密封晶片與LID的高信賴性熱硬化膠
・絕緣增層膜BUF：用於封裝基板微細線路層形成的層間絕緣材料
We are pleased to announce that Sekisui Chemical will be exhibiting at "SEMICON TAIWAN 2026," which will be held for three days from September 2nd (Wednesday) to September 4th (Friday) at the Taipei Nangang Exhibition Center, Halls 1 & 2 (TaiNEX 1 & 2). At our booth this year, we will showcase products related to semiconductor manufacturing processes, development-stage sustainable alternatives to PFAS, high-performance materials, and the latest technologies from across our Group.
Despite your busy schedule, we sincerely welcome you to visit our booth and look forward to seeing you there.
Sincerely yours,
Event Details
- Date & Time
Wednesday, September 2, 2026: 10:00 – 17:00
Thursday, September 3, 2026: 10:00 – 17:00
Friday, September 4, 2026: 10:00 – 16:00
- Venue
Taipei Nangang Exhibition Center, Halls 1 & 2 (TaiNEX 1 & 2)
Address: No. 1 & No. 2, Jingmao 2nd Rd., Nangang Dist., Taipei City
- Our Booths
TaiNEX 1, 5F Hall – Booth No.: H0031
TaiNEX 2, 4F Hall – Booth No.: S8343
- Key Exhibits
1) Piping Materials
・Polyethylene Piping Materials for Ultrapure Water (CLPE):
Next-generation sustainable piping materials as a PFAS alternative.
・PVC Piping Materials for Ultrapure Water (CLVP):
PP-alternative/general-purpose piping materials (Made in TAIWAN).
2) Semiconductor Materials Used in Manufacturing Processes
・SELFA: High-adhesion, easy-peeling tape used during semiconductor wafer and chip manufacturing.
・Inkjet: Photo-curable, high-viscosity inks and DAM materials for inkjet printing.
・Thermal Interface Materials (Thermal Sheets): Thermal management components featuring excellent thermal conductivity and insulation.
・CPO Adhesives: High-adhesion, low-shrinkage UV optical adhesives for fixing optical fibers in CPO modules.
・Water-Cooling Sealants: High-reliability thermosetting adhesives for sealing chips and LIDs.
・Build-up Films: Interlayer insulating materials used for forming fine wiring layers on package substrates.