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Applicarionn
Tape CSP

Big difference of CTE between PI tape and mother board.
Please refer to the Evaluation result 1.

Wafer Level CSP

Big difference of CTE between silicon chip and mother board.

Stacked CSP

Co - planarity and gap holding ability between every board.

Modules for High-frequency

Potential application Bluetooth radio module
courtesy Ericsson Microelectronics

*Gap holding ability for exact designed frequency.
*Big difference of CTE between ceramic and mother board.

If it is exposed parts,
it is difficult to hold desirable gap using

ordinary solder ball.
It is impossible to use underfill

High reliability "Micropearl SOL" can solve.

If you have questions, Please contact us about solder joint.

We propose the composition suitable for use material.
Please contact us light-heartedly from contact form.