About excellent reliability

By using plastic ball as a core having low Young's moduluses, solder hardness is moderated and the stress on a ball is a relaxed.

As a result, the stress doesn't concentrate on the solder joint and the life is prolonged.
In a temperature cycle test by customers, SOL gets a high evaluation result.

Micropearl SOL500m :Plastic core/Cu/eutectic solder(Sn/Pb)

Courtesy : Hyundai MicroElectronics Co.
"CSP Board Level Reliability Testing of Pb-free Sn-Ag-X and Polymer-core Ball"

Micropearl SOL-300m : Plastic core/Cu/Pb free solder(Sn/Ag)

Weibull Cumulatove Hazard Analysis of TCT on Board

Micropearl SOL-500m :Plastic core/Cu/eutectic solder(Sn/Pb)