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Assembly Applications

A series of conductive fine particle products to ensure conductive connections for reliable chip mounting.Sekisui's conductive fine particles are widely used in the process of LSI chip mounting. By adding conductivity to the precise fine particles developed through years of experience, Sekisui offers conductive particles that are well accepted for both LCD construction and device mounting, and enable further size reduction of IT devices, higher integration of chips and better reliability of devices.

Available Products

Micropearl SOL for mounting CSP/BGA, Flip Chip, etc.

Micropearl SOL' is a true sphere, made of solder-plated, compliant particles core. This soft, precision-sized plastic core eliminates the disadvantages of conventional solder balls, which are which crack under heat cycle testing, and are not as uniform in size./ SOL supports the continuing size reduction and improving reliability of IT devices.

Micropearl AU for anisotropic conduction.

Micropearl AU' is made of gold-plated high precision fine particles and is highly conductive. It is widely used in LCD and device mounting, and meets the needs of future higher integration.